Current price of 70-2102-0510 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]
Type | Description |
---|---|
Series: | R562 |
Package: | Jar |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn63Pb37 (63/37) |
Diameter: | - |
Melting Point: | 361°F (183°C) |
Flux Type: | Water Soluble |
Wire Gauge: | - |
Process: | Leaded |
Form: | Jar, 17.64 oz (500g) |
Shelf Life: | 6 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
TXRX SFP+ SGL 10GB/S 1310NM
HC49 30PPM @25C 30PPM (-20 TO 7
R562 SOLDERPASTE WATER SOL 500G
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