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Type | Description |
---|---|
Series: | NXG1 |
Package: | Bulk |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn99.3Cu0.7 (99.3/0.7) |
Diameter: | - |
Melting Point: | 441°F (227°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Jar, 17.64 oz (500g) |
Shelf Life: | 8 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
SOLDER PASTE NXG1 NO CLEAN 500GM