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Type | Description |
---|---|
Series: | - |
Package: | Bag |
Part Status: | Active |
Proto Board Type: | SMD to DIP |
Package Accepted: | LQFP, QFP, TQFP |
Number of Positions: | 52 |
Pitch: | 0.100" (2.54mm) |
Board Thickness: | 0.063" (1.60mm) |
Material: | FR4 Epoxy Glass |
Size / Dimension: | 2.937" L x 0.940" W (74.60mm x 23.90mm) |
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ARINC 801, SM, PULL PROOF TERMIN