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Type | Description |
---|---|
Series: | - |
Package: | Bag |
Part Status: | Active |
Proto Board Type: | SMD to DIP |
Package Accepted: | SOIC, SOP, SSOP |
Number of Positions: | 20 |
Pitch: | 0.100" (2.54mm) |
Board Thickness: | 0.063" (1.60mm) |
Material: | FR4 Epoxy Glass |
Size / Dimension: | - |
RES SMD 15.4 OHM 0.1% 1/4W 0805
CAP ALUM 220UF 20% 350V SNAP
CONN RCPT CLUSTER BLOCK HSG 3POS
SOP-20/SSOP-20/SOIC-20 TO DIP-20