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Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Kit Type: | Physical Science |
Main Purpose: | Thermal Transfer |
Interconnect System: | - |
Suggested Programming Environment: | - |
Utilized IC / Part: | - |
Included MCU/MPU Board(s): | - |
HAN-ECO 10E-F-S
HEAT SINK EXPERIMENT KIT
SINGLE BUILDTAK ORIGINAL SURFACE
1/2 BLANK INSERT, ARCTIC WHITE