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Type | Description |
---|---|
Series: | Gap Pad® 3004SF |
Package: | Bulk |
Part Status: | Active |
Usage: | Thermally Conductive |
Type: | Gap Filler Pad, Sheet |
Shape: | Rectangular |
Outline: | 457.20mm x 228.60mm |
Thickness: | 0.125" (3.18mm) |
Material: | Non-Silicone |
Adhesive: | Tacky - Both Sides |
Backing, Carrier: | Fiberglass |
Color: | Gray |
Thermal Resistivity: | - |
Thermal Conductivity: | 3.0W/m-K |
MEMS OSC XO 75.0000MHZ LVCMOS LV
CONN HEADER R/A 59POS 2.54MM
CONN SOCKET 66POS 0.1 GOLD PCB
BERGQUIST GAP PAD TGP 3004SF