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Type | Description |
---|---|
Series: | - |
Package: | Bar |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter: | - |
Melting Point: | 423°F (217°C) |
Flux Type: | - |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Jar, 17.64 oz (500g) |
Shelf Life: | 6 Months |
Shelf Life Start: | - |
Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
RES SMD 160K OHM 5% 1/2W 1210
RES 320K OHM 1% 1/10W 0603
BASE FOR TUBE D25MM, PL. GY
SAC0307 HF212AGS88.5