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Type | Description |
---|---|
Series: | - |
Package: | Tray |
Part Status: | Active |
Type: | LGA |
Number of Positions or Pins (Grid): | 1207 (33 x 34) |
Pitch - Mating: | 0.043" (1.09mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | - |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Surface Mount |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.043" (1.09mm) |
Contact Finish - Post: | - |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | - |
Housing Material: | Thermoplastic |
Operating Temperature: | -55°C ~ 110°C |
TXRX SFP SGL 2.125GB/S 850NM
CERAMIC - 5X20MM (UL), FAST 2.5A
MODEM V.22BIS SERIAL DATA 3.3V
CONN SOCKET LGA 1207POS GOLD