NXP Semiconductors has developed a digital signal processing (DSP) chip for AI-based audio in software-defined vehicles (SDVs) and software-defined radio (SDR).
NP12-0B platform provides rugged RF, DC performance with added moisture resistance enabling the use of plastic packages for high-performance power applications
Materials companies Element Six (E6) and Orbray have announced a strategic collaboration to deliver high-quality wafer-scale single crystal (SC) synthetic diamond.