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Type | Description |
---|---|
Series: | 800 |
Package: | Tube |
Part Status: | Active |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 40 (2 x 20) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 5.00µin (0.127µm) |
Contact Material - Mating: | Copper Alloy |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin-Lead |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Copper Alloy |
Housing Material: | Polyester |
Operating Temperature: | -55°C ~ 105°C |
RES ARRAY 4 RES 5.1K OHM 2009
PWR ENT RCPT IEC320-C20 PANEL QC
CONN IC DIP SOCKET 40POS GOLD
CONN IND MINI I HEADER 8P RA SMD