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Type | Description |
---|---|
Series: | - |
Package: | Tube |
Part Status: | Active |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 40 (2 x 20) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Tin |
Contact Finish Thickness - Mating: | 100.0µin (2.54µm) |
Contact Material - Mating: | Phosphor Bronze |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 100.0µin (2.54µm) |
Contact Material - Post: | Phosphor Bronze |
Housing Material: | Polybutylene Terephthalate (PBT), Glass Filled |
Operating Temperature: | -40°C ~ 105°C |
XTAL OSC VCXO 500.0000MHZ HCSL
XTAL OSC VCXO 216.0000MHZ LVDS
CONN IC DIP SOCKET 40POS TIN
IC BUFFER 1.8V 56BIT 176-TFBGA