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Type | Description |
---|---|
Series: | BU-178HT |
Package: | Tube |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 18 (2 x 9) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 78.7µin (2.00µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Surface Mount |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Copper |
Contact Finish Thickness - Post: | Flash |
Contact Material - Post: | Brass |
Housing Material: | Polybutylene Terephthalate (PBT), Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
CONN IC DIP SOCKET 18POS GOLD
EVAL BOARD HMC520LC4
CONN BARRIER STRIP 4CIRC 0.325"
019616-0020