Current price of 44-547-11 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]
Type | Description |
---|---|
Series: | 547 |
Package: | Bulk |
Part Status: | Active |
Type: | SOIC, ZIF (ZIP) |
Number of Positions or Pins (Grid): | 44 (2 x 22) |
Pitch - Mating: | - |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 20.0µin (0.51µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.050" (1.27mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 20.0µin (0.51µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature: | - |
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