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Type | Description |
---|---|
Series: | 510 |
Package: | Bulk |
Part Status: | Active |
Type: | SIP |
Number of Positions or Pins (Grid): | 20 (1 x 20) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 20.0µin (0.51µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 20.0µin (0.51µm) |
Contact Material - Post: | Copper |
Housing Material: | Thermoplastic, Polyester |
Operating Temperature: | - |
XTAL OSC VCXO 281.0000MHZ HCSL
DIODE SBR SMAF
CONN SOCKET SIP 20POS GOLD
HDM SMPR070F120OK