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Type | Description |
---|---|
Series: | XR2 |
Package: | Bulk |
Part Status: | Active |
Type: | SIP |
Number of Positions or Pins (Grid): | 3 (1 x 3) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Polybutylene Terephthalate (PBT), Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
CRYSTAL 31.2500MHZ 4PF SMD
MEMS OSC XO 30.0000MHZ H/LV-CMOS
CONN SOCKET SIP 3POS GOLD
XTAL OSC XO 25.1250MHZ HCMOS SMD