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Type | Description |
---|---|
Series: | Diplomate DL |
Package: | Tube |
Part Status: | Obsolete |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 24 (2 x 12) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Thermoplastic |
Operating Temperature: | -55°C ~ 125°C |
CRYSTAL 30.0000MHZ 18PF SMD
MEMS OSC XO 74.175824MHZ LVCMOS
JUMPER TERM BLK 2POS SCREW-IN
CONN IC DIP SOCKET 24POS GOLD