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Type | Description |
---|---|
Series: | - |
Package: | Tray |
Part Status: | Obsolete |
Type: | LGA |
Number of Positions or Pins (Grid): | 771 (33 x 33) |
Pitch - Mating: | 0.043" (1.09mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | - |
Contact Material - Mating: | Copper Alloy |
Mounting Type: | Surface Mount |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.043" (1.09mm) |
Contact Finish - Post: | - |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | - |
Housing Material: | Thermoplastic |
Operating Temperature: | -25°C ~ 100°C |
CIRCULAR
CONN SOCKET LGA 771POS GOLD
GIC 3.5W 2P CAP G
MODULE ISOL CURR-IN