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Type | Description |
---|---|
Series: | 57 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 48 (2 x 24) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Nickel Boron |
Contact Finish Thickness - Mating: | 50.0µin (1.27µm) |
Contact Material - Mating: | Beryllium Nickel |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Nickel Boron |
Contact Finish Thickness - Post: | 50.0µin (1.27µm) |
Contact Material - Post: | Beryllium Nickel |
Housing Material: | Polyetheretherketone (PEEK), Glass Filled |
Operating Temperature: | -55°C ~ 250°C |
NMP CONFIGURABLE POWER SUPPLY 12
MEMS OSC XO 133.3000MHZ LVPECL
XTAL OSC VCXO 161.13281MHZ LVDS
CONN IC DIP SOCKET ZIF 48POS