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Type | Description |
---|---|
Series: | D0 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 6 (2 x 3) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Wire Wrap |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 196.9µin (5.00µm) |
Contact Material - Post: | Brass |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
RES ARRAY 8 RES 90.9 OHM 1606
XTAL OSC VCXO 25.0000MHZ LVPECL
ACT94MB05PN-6149
CONN IC DIP SOCKET 6POS GOLD