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Type | Description |
---|---|
Series: | - |
Package: | Tray |
Part Status: | Active |
Type: | PGA, ZIF (ZIP) |
Number of Positions or Pins (Grid): | 370 (19 x 19) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 15.0µin (0.38µm) |
Contact Material - Mating: | Copper Alloy |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 15.0µin (0.38µm) |
Contact Material - Post: | Copper Alloy |
Housing Material: | Liquid Crystal Polymer (LCP) |
Operating Temperature: | - |
RES SMD 560 OHM 0.25% 1/8W 0805
MEMS OSC XO 74.1760MHZ H/LV-CMOS
IC REG LINEAR 3.6V 150MA SC82AB
CONN SOCKET PGA ZIF 370POS GOLD