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Type | Description |
---|---|
Series: | BDN |
Package: | Box |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins |
Length: | 1.310" (33.27mm) |
Width: | 1.310" (33.27mm) |
Diameter: | - |
Fin Height: | 0.355" (9.02mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 6.00°C/W @ 400 LFM |
Thermal Resistance @ Natural: | 16.10°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
RES SMD 9.1KOHM 1% 35W TO263DPAK
COOLX POWER SUPPLY
HEATSINK CPU W/ADHESIVE 1.31"SQ
HIGH INPUT BRICK DC-DC CQB75-300