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Type | Description |
---|---|
Series: | BDN |
Package: | Bulk |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins |
Length: | 1.010" (25.65mm) |
Width: | 1.010" (25.65mm) |
Diameter: | - |
Fin Height: | 0.555" (14.10mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 6.30°C/W @ 400 LFM |
Thermal Resistance @ Natural: | 20.80°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
FIXED IND 1.5NH 300MA 100 MOHM
FIXED IND 6.8UH 274MA 2 OHM SMD
RES 14K OHM 0.1% 1/16W 0603 1K
HEATSINK CPU W/ADHESIVE 1.01"SQ