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Type | Description |
---|---|
Series: | 624 |
Package: | Bulk |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins |
Length: | 0.827" (21.00mm) |
Width: | 0.827" (21.00mm) |
Diameter: | - |
Fin Height: | 0.350" (8.89mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 15.00°C/W @ 400 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Black Anodized |
RES SMD 536 OHM 1% 1/4W 1206
RES SMD 4.3K OHM 0.5% 1/10W 0603
CAP CER 68PF 500V C0G/NP0 1206
HEATSINK FOR 21MM BGA