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Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Not Included) |
Shape: | Cylindrical |
Length: | - |
Width: | - |
Diameter: | 0.300" (7.62mm) ID, 1.125" (28.57mm) OD |
Fin Height: | - |
Power Dissipation @ Temperature Rise: | 1.5W @ 40°C |
Thermal Resistance @ Forced Air Flow: | 8.00°C/W @ 400 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Black Anodized |
RES 51K OHM 1% 1/5W 0603
CAP ALUM 270UF 20% 200V SNAP
HEATSINK FOR PWR MOD/IGBT/RELAY
BOARD LEVEL HEAT SINK