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Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Obsolete |
Type: | Top Mount |
Package Cooled: | TO-252 (DPak) |
Attachment Method: | SMD Pad |
Shape: | Rectangular, Fins |
Length: | 0.315" (8.00mm) |
Width: | 0.900" (22.86mm) |
Diameter: | - |
Fin Height: | 0.400" (10.16mm) |
Power Dissipation @ Temperature Rise: | 2.5W @ 35°C |
Thermal Resistance @ Forced Air Flow: | 17.50°C/W @ 300 LFM |
Thermal Resistance @ Natural: | - |
Material: | Copper |
Material Finish: | Tin |
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