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Type | Description |
---|---|
Series: | Tflex™ HD300 |
Package: | Bulk |
Part Status: | Active |
Usage: | - |
Type: | Gap Filler Pad, Sheet |
Shape: | Square |
Outline: | 228.60mm x 228.60mm |
Thickness: | 0.0300" (0.762mm) |
Material: | Silicone, Ceramic Filled |
Adhesive: | Tacky - Both Sides |
Backing, Carrier: | Liner |
Color: | Pink |
Thermal Resistivity: | - |
Thermal Conductivity: | 2.7W/m-K |
3.2X2.5 30PPM @25C 30PPM (-20 TO
MEMS OSC XO 40.5000MHZ H/LV-CMOS
IDC CBL - HHSC14H/AE14M/HHPK14H
TFLEX HD330MTG 9X9"