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Type | Description |
---|---|
Series: | Proto-Advantage |
Package: | Bulk |
Part Status: | Active |
Proto Board Type: | SMD to DIP |
Package Accepted: | BGA |
Number of Positions: | 54 |
Pitch: | 0.029" (0.75mm) |
Board Thickness: | 0.062" (1.57mm) 1/16" |
Material: | FR4 Epoxy Glass |
Size / Dimension: | 1.000" x 2.700" (25.40mm x 68.58mm) |
BGA-54 TO DIP-54 SMT ADAPTER
RF SHIELD COVER, 0.65"X0.65"
CONN HDR 40POS 0.1 STACK T/H
MODULE SPM 600V 20A DIP-023