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Type | Description |
---|---|
Series: | Proto-Advantage |
Package: | Bulk |
Part Status: | Active |
Proto Board Type: | SMD to DIP |
Package Accepted: | DFN |
Number of Positions: | 16 |
Pitch: | 0.020" (0.50mm) |
Board Thickness: | 0.062" (1.57mm) 1/16" |
Material: | FR4 Epoxy Glass |
Size / Dimension: | 0.700" x 1.000" (17.78mm x 25.40mm) |
FLEX CC ARCHITECTURAL FLEXIBLE L
MEMS OSC XO 14.0000MHZ H/LV-CMOS
DFN-16-EXP-PAD TO DIP-20 SMT
CELLULAR ROUTER GLOBAL HSPA 3G