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Type | Description |
---|---|
Series: | Proto-Advantage |
Package: | Bulk |
Part Status: | Active |
Proto Board Type: | SMD to DIP |
Package Accepted: | TSSOP |
Number of Positions: | 64 |
Pitch: | 0.020" (0.50mm) |
Board Thickness: | 0.062" (1.57mm) 1/16" |
Material: | FR4 Epoxy Glass |
Size / Dimension: | 1.000" x 3.200" (25.40mm x 81.28mm) |
RJ45 COUPLING DEGREE OF PROTECTI
TSSOP-64-EXP-PAD TO DIP-64 SMT
IC INTFACE SPECIALIZED 256CSBGA
CONN HDR 16POS 0.1 STACK T/H