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Type | Description |
---|---|
Series: | - |
Package: | Bag |
Part Status: | Active |
Proto Board Type: | SMD to DIP |
Package Accepted: | SOIC, SOP, SSOP |
Number of Positions: | 8 |
Pitch: | 0.100" (2.54mm) |
Board Thickness: | 0.063" (1.60mm) |
Material: | FR4 Epoxy Glass |
Size / Dimension: | 0.433" L x 0.472" W (11.00mm x 12.00mm) |
RES ARRAY 4 RES 2.26K OHM 0804
SOP-8/SSOP-8/SOIC-8 TO DIP-8
POWER ALERT
ALNA1