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Type | Description |
---|---|
Series: | - |
Package: | Bag |
Part Status: | Active |
Proto Board Type: | SMD to DIP |
Package Accepted: | SOIC, SOP, SSOP |
Number of Positions: | 18 |
Pitch: | 0.100" (2.54mm) |
Board Thickness: | 0.063" (1.60mm) |
Material: | FR4 Epoxy Glass |
Size / Dimension: | 0.905" L x 0.744" W (23.00mm x 18.90mm) |
RES ARRAY 4 RES 115 OHM 1206
KNOB SMOOTH 0.125" METAL
CIRCUIT SCRIBE CONDUCTIVE INK PE
SOP-18/SSOP-18/SOIC-18 TO DIP-18