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Type | Description |
---|---|
Series: | NIC 3.0 |
Package: | Bulk |
Part Status: | Active |
Type: | Fingerstock |
Shape: | - |
Width: | - |
Length: | - |
Height: | - |
Material: | Beryllium Copper |
Plating: | - |
Plating - Thickness: | - |
Attachment Method: | - |
Operating Temperature: | - |
TOOL EXTRACTION FOR APD 2WAY
IC MUX/DEMUX DUAL 4CH 16SOIC
IC ACCELERATOR I2C HOTSWAP 8MSOP
VSLMT,STR,SNB,USFT,CTL 0.11*0.32