67SLG050050030PI00

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Part No :

67SLG050050030PI00

Manufacturer
Laird - Performance Materials
Description
METAL FILM OVER FOAM CONTACTS
Catalog
RFI and EMI - Contacts, Fingerstock and Gaskets
Shipped from
HK warehouse
Expected Shipping Date
Jul 29 - Aug 02 2025
DataSheet
67SLG050050030PI00 PDF
Availability
0 pieces
Unit Price
$0.15300

Current price of 67SLG050050030PI00 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]

Type Description
Series:SMD Grounding Metallized
Package:Tape & Reel (TR)Cut Tape (CT)
Part Status:Active
Type:Film Over Foam
Shape:Rectangle
Width:0.197" (5.00mm)
Length:0.118" (3.00mm)
Height:0.197" (5.00mm)
Material:Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Plating:-
Plating - Thickness:-
Attachment Method:Solder
Operating Temperature:-40°C ~ 70°C
  • Please confirm the specifications of the products when ordering.
  • MOQ means the minimum order quantity required to purchase each parts.
  • If you have special order instructions,please note it on the ordering pages.
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  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped. (It may take up to 24 hours before carriers display the info.)
HOT 0097078200

0097078200

DCON,50P,BF
HOT 4283AB51K09600

4283AB51K09600

GK NICU NRS PU V0 DSH
HOT 9-19UD-AU-16

9-19UD-AU-16

0.09 X 0.19 AU 16--9-19UD-AU-16-
X3C07P1-03S

X3C07P1-03S

RF DIR COUPLER 600-900MHZ 4SMD

AS3900-BQFP

AS3900-BQFP

IC RF TXRX ISM<1GHZ 28WFQFN

DS90UR908Q-EVK/NOPB

DS90UR908Q-EVK/NOPB

EVAL BOARD FOR DS90UR908Q

67SLG050050030PI00

67SLG050050030PI00

METAL FILM OVER FOAM CONTACTS

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