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Type | Description |
---|---|
Series: | CHO-BOND® 360-20 |
Package: | Bulk |
Part Status: | Active |
Type: | EMI Conductive Adhesive |
Shape: | - |
Length: | - |
Width: | - |
Thickness - Overall: | - |
Operating Temperature: | - |
Adhesive: | - |
Material: | Epoxy, 2 Part |
INDUCT ARRAY 2 COIL 47UH SMD
PANEL FRONT 19X14X0.13" NAT
SILVER COPPER EMI EPOXY 1PT
IC FLASH 128GBIT MMC 169WFBGA