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Type | Description |
---|---|
Series: | CHO-BOND® 1038 |
Package: | Bulk |
Part Status: | Active |
Type: | EMI Conductive Adhesive |
Shape: | - |
Length: | - |
Width: | - |
Thickness - Overall: | - |
Operating Temperature: | - |
Adhesive: | - |
Material: | Silicone |
OSC MEMS XO DUAL OUTPUT
OSC MEMS XO DUAL OUTPUT
SILVER CU EMI SEAL 114G W/ PRIME
PWR DISTRIB BLOCK 3POS 175A 600V