Current price of 50-01-0584-0208 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]
Type | Description |
---|---|
Series: | CHO-BOND® 584-208 |
Package: | Bulk |
Part Status: | Active |
Type: | EMI Conductive Adhesive |
Shape: | - |
Length: | - |
Width: | - |
Thickness - Overall: | - |
Operating Temperature: | - |
Adhesive: | - |
Material: | Epoxy, 2 Part |
IC RTC CAL I2C/2-WIRE SER 8TDFN
ADM3063E EVAL BOARD
SILVER EMI EPOXY 16OZ KIT
RX TXRX MODULE BT TRC ANT SMD