BGA0009-S

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Part No :: BGA0009-S

Manufacturer: Chip Quik, Inc.

Description: STENCIL BGA-484 1.27MM

Catalog: Solder Stencils, Templates

Shipped from: HK warehouse

Expected Shipping Date: Jul 30 - Aug 03 2025

DataSheet: BGA0009-S PDF

Availability: 14 pieces

Unit Price: ~~$20.99000~~

Current price of BGA0009-S is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]

BGA0009-S Specifications

Type	Description
Series:	Proto-Advantage BGA
Package:	Bulk
Part Status:	Active
Type:	BGA
Number of Positions:	484
Pitch:	0.050" (1.27mm)
Outer Dimension:	2.600" L x 1.800" W (66.04mm x 45.72mm)
Inner Dimension:	-
Thermal Center Pad:	-
Material:	Stainless Steel

Please confirm the specifications of the products when ordering.
MOQ means the minimum order quantity required to purchase each parts.
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The Pre-Shipment Inspection (PSI) will be applied.
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Delivery time: At the same day (Order deadline is 2pm, HK Time).
Delivery date: usually 2 to 7 working days.
It is unable to appoint a date of delivery.
Tracking number will be sent once your order has been shipped. (It may take up to 24 hours before carriers display the info.)

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