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Type | Description |
---|---|
Series: | Profile®, 256 |
Package: | Jar |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn63Pb37 (63/37) |
Diameter: | - |
Melting Point: | 361°F (183°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Leaded |
Form: | Jar, 17.64 oz (500g) |
Shelf Life: | 6 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
SOLDERPASTE NO CLEAN 63/37 500GM
CONN TERM BLK 90DEG BARRIER
WEIGH SCALE MOISTURE ANALYZER
EXT O= .250,L= .73,W= .020