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Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn63Pb37 (63/37) |
Diameter: | - |
Melting Point: | 361°F (183°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Leaded |
Form: | Jar, 1.76 oz (50g) |
Shelf Life: | 12 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 68°F ~ 77°F (20°C ~ 25°C) |
RES 374 OHM 0.1% 1/4W 0805
THERMALLY STABLE SOLDER PASTE NO
CONN TERM BLK SHIELD CONN
CORD C13 - C14 14AWG BLUE 3FT