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Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn99.244Cu0.7 (Ni0.05/Ge0.006) |
Diameter: | - |
Melting Point: | 441°F (227°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Syringe, 1.23 oz (35g), 10cc |
Shelf Life: | 6 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 37°F ~ 46°F (3°C ~ 8°C) |
RES 352 OHM 0.25% 1/10W 0603
GERMANIUM DOPED SOLDER PASTE NO-
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