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Type | Description |
---|---|
Series: | - |
Package: | Syringe |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter: | - |
Melting Point: | 423 ~ 428°F (217 ~ 220°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Syringe, 1.23 oz (35g), 10cc |
Shelf Life: | 6 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 37°F ~ 46°F (3°C ~ 8°C) |
RES 2.49M OHM 1.5W 1% AXIAL
SOLDER PASTE NO-CLEAN 10CC SYR
CONN D-SUB HD HOUSING RCPT 26POS
D38999/23HH1SC