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Type | Description |
---|---|
Series: | 500 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 24 (2 x 12) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
Contact Material - Mating: | Copper Alloy |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin-Lead |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Copper Alloy |
Housing Material: | Polyester |
Operating Temperature: | -55°C ~ 105°C |
FIXED IND 3.3UH 5A 38 MOHM SMD
CONN HEADER SMD 4POS 2MM
CONN HEADER R/A 4POS 3.2MM
CONN IC DIP SOCKET 24POS GOLD